DARPA ERI Summit 2018: Next Wave of Electronics-Driven Applications
DARPA ERI Summit 2018: Next Wave of Electronics-Driven Applications
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DARPA ERI Summit 2018: Next Wave of Electronics-Driven Applications

DARPA ERI Summit 2018: Next Wave of Electronics-Driven Applications

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DARPA ERI Summit 2018: The End of Moore’s Law & Faster General Purpose Computing, & a New Golden Age

DARPA ERI Summit 2018: The End of Moore’s Law & Faster General Purpose Computing, & a New Golden Age

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DARPA ERI Summit 2018: The Intertwined History of DARPA & Moore's Law

DARPA ERI Summit 2018: The Intertwined History of DARPA & Moore's Law

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DARPA ERI Summit 2018: New Commercial DoD Partnership Models

DARPA ERI Summit 2018: New Commercial DoD Partnership Models

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DARPA ERI Summit 2018: Welcome and Announcement of ERI "Page 3" Teams

DARPA ERI Summit 2018: Welcome and Announcement of ERI "Page 3" Teams

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DARPA ERI Summit 2018: Another Brick in the Wall

DARPA ERI Summit 2018: Another Brick in the Wall

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ERI Summit 2019: Intelligent Design of Electronic Assets (IDEA) & Posh Open Source Hardware (POSH)

ERI Summit 2019: Intelligent Design of Electronic Assets (IDEA) & Posh Open Source Hardware (POSH)

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ERI Summit 2019: Dr. Jay Lewis, Deputy Director, DARPA MTO

ERI Summit 2019: Dr. Jay Lewis, Deputy Director, DARPA MTO

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2023 ERI Summit: Hype Video

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ERI Summit 2019: Space Applications / Future Technology: Domain Specific System on Chip (DSSoC)

ERI Summit 2019: Space Applications / Future Technology: Domain Specific System on Chip (DSSoC)

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ERI Summit 2020: Day 3 Welcome and Introductory Remarks and Fireside Chats

ERI Summit 2020: Day 3 Welcome and Introductory Remarks and Fireside Chats

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Electronics Resurgence

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ERI Summit 2019: Circuit Realization at Faster Timescales (CRAFT)

ERI Summit 2019: Circuit Realization at Faster Timescales (CRAFT)

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ERI Summit 2019: Dr. Lisa Su, CEO, AMD

ERI Summit 2019: Dr. Lisa Su, CEO, AMD

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2021 ERI Summit: Technical Session: Mitigating Electronic Design Barriers

2021 ERI Summit: Technical Session: Mitigating Electronic Design Barriers

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ERI Summit 2019: Mr. Steve Mollenkopf, CEO, Qualcomm Incorporated

ERI Summit 2019: Mr. Steve Mollenkopf, CEO, Qualcomm Incorporated

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ERI Summit 2019: Mr. John Neuffer, President, Semiconductor Industry Association (SIA)

ERI Summit 2019: Mr. John Neuffer, President, Semiconductor Industry Association (SIA)

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ERI Summit 2019: Hierarchical Identify Verify Exploit (HIVE)

ERI Summit 2019: Hierarchical Identify Verify Exploit (HIVE)

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ERI Summit 2019: Domain-Specific System on Chip (DSSoC)

ERI Summit 2019: Domain-Specific System on Chip (DSSoC)

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ERI Summit 2019: Dr. Praveen Pilly, Senior Researcher, HRL Laboratories

ERI Summit 2019: Dr. Praveen Pilly, Senior Researcher, HRL Laboratories

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